NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. NexPlanar uses proprietary “nano-domain” technology that improves planarity and across-wafer uniformity and can be utilized to customize the CMP pads for specific applications. NexPlanar’s “nano-lubricants” and patented molded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, low slurry consumption processing and lower overall cost of ownership.
NexPlanar, Inc. is backed by a group of blue chip investors including Interwest Partners, Blue Run Ventures, Smart Forrest Ventures and Intel Capital.
For more information on Nexplanar, Inc. visit their website at http://www.nexplanar.com.